The material characteristic information obtained through TMA is extremely important for the design and process of various products, such as electronic chip packaging, circuit boards, polymer materials, fiber dyeing, and engine design. TMA is an indispensable instrument for products whose dimensions change with temperature.

Wide range of applications
TMA has a force range from 0.01mN to 5.8N, providing a wide range of sample types for analysis, including softening point testing that requires significant force. It can be applied to materials ranging from single fibers to high-density composite materials. For samples with significant size changes during the heating process, such as fibers or films, a displacement range of ± 5000 μ m can be provided, allowing the instrument to perform continuous monitoring and application analysis in situations of significant size changes.

TMA can measure the following data:

• Young's modulus
• Ceramic magnetic sintering Sinterene
• Mechanical viscoelastic properties Module/Viscosity&tan δ
• Stress relaxation
• Stress strain
• Creep latent value
• Gel time
• Peeling time
• Shrinking point
• Softening point
• Glass transition temperature

• Coefficient of Thermal Expansion (CTE)

• CTE issues: dimensional stability, composite materials, circuit board delamination, packaging, material warping
  Softening issues: Thermoplastic materials, tin lead alloy materials
  Shrinkage issues: packaging materials, films, fibers
  Stripping time and bursting time: PCB board